Product - MR. JO Tecbond-LV

Description

Mr. JO Tecbond-LV is a strong, two-part epoxy glue that works for electrical, industrial, and metal-to-composite bonding. It has great strength and can handle high heat (from -25°C to 60°C), so it lasts a long time. Also, it is easy to apply because it has a thin, smooth texture, making it perfect for gluing metals, electrical parts, and other things together.

This clear glue makes a strong, lasting bond. It works well on metals, composites, and electrical parts, and it helps protect against the environment. Plus, the glue has a mixing ratio of 100:10, which makes it easy to use, and you have 100-120 minutes to apply it before it sets.

Whether you need it for electrical work, industrial repairs, or metal bonding, Mr. JO Tecbond-LV is the right glue for you. So, upgrade your projects with this strong and reliable glue today!

• Color: Clear
• Pot life @25°C: 100-120 mins
• Mixing Ratio: 100:10 PBW
• Mixture consistency: Low Viscous liquid
• Dielectric strength: 15-20 kv/mm for 3mm thickness
• Thermal resistance: -25°C to 60°C
• Optics: Transparent​​

• Electrical bonding
• Metal to composite bonding
• Creep resist bonding
• High performance bonding

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Surface Preparation​

• The mixture should be applied on a clean, rough and dry surface.
• This should be achieved by suitable mechanical and chemical means such as sandblasting Wire brushing or chemical etching.
• Suitable degreasing agent should be used to remove any grease, or oil traces on the surface.

Application Method​

• Use Jpoxy Part-A & Part-B in ratio 100:10 pbw. Mix the two components in small batches thoroughly for at least 2minutes. Apply the mix directly or using proper spatula to the pretreated surfaces. ​
• The joint components should be assembled as soon as the adhesive has been applied. ​
• Allow the material to cure for at least 24 hours before putting to use. ​

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A1. MR. JO Tecbond – LV is a low-viscosity, rigid-setting epoxy adhesive designed for:

• Encapsulation and potting of electrical/electronic components
• Bonding fine parts and narrow gaps
• Sealing detailed surfaces
• Applications where flowability is key, but flexibility is not required

• It has a much lower viscosity, making it ideal for flowing into small crevices, joints, and cavities
• It cures rigid, not flexible
• It is clear when applied, but may yellow slightly during cure depending on volume and heat dissipation

• Electronics manufacturers for potting and sealing
• Craftsmen and fabricators for clean, invisible bonds
• Tooling and repair technicians for tight-tolerance fillinG

• Mixing Ratio: 100 parts resin to 10 parts hardener by weight (100:10 phr)
• Pot Life: ~45–60 minutes at 25°C
• Full Cure: 24 hours at room temperature; faster with mild he

A5. Large batch volumes can cause excessive heat build-up (exotherm) during curing, which may lead to:

• Rapid curing
• Increased yellowing
• Cracking or shrinkage To avoid this, mix smaller quantities, use shallow containers, or cast in thin layers.

A6. No. MR. JO Tecbond – LV cures to a hard, rigid finish—similar to most standard epoxies. It is not suitable for flexible or shock-absorbing joints.

A7. Yes, it is highly flowable and self-leveling, making it excellent for:

• Potting
• Encapsulating
• Flat surface bonding

A8.

• Initially clear
• May yellow slightly during cure, especially in thick sections or high ambient temperature
• Finishes rigid and smooth, suitable for sanding or coating

• Offers moderate moisture resistance
• Suitable for temperatures up to ~70°C
• Not intended for high-heat or outdoor UV-intensive applications

A10. Yes, but adding pigments or fillers will slightly increase viscosity. Always test compatibility and color stability on a small batch first.

A11. Store both components in cool, dry conditions, tightly sealed. Avoid humidity and direct sunlight. Shelf life: 12 months if unopened.